SpaceX’s Earnings Debut, and the $116 Billion Question
On Tuesday, SpaceX publishes the first earnings report of its life as a public company, and the numbers will land in a tense week. Morgan Stanley has kept its $300…
Europe’s AI Rules Start to Bite
On August 3, the European Union’s AI law crossed from rulebook to enforcement. Regulators for the first time hold the power to fine or restrict general-purpose AI models, and OpenAI,…
Memory Stocks Take Their First Hard Hit
The two companies that rode the AI memory boom hardest fell hardest. Samsung Electronics and SK Hynix each dropped nearly 9% on August 3, and the KOSPI closed down 5.12%…
TSMC’s Capacity Race Runs Ahead of Schedule
Inside TSMC’s fabs, the 3-nanometer lines are filling up sooner than planned. Monthly 3nm capacity will reach 180,000 wafers in the early fourth quarter, two to three months ahead of…
Germany’s Case Against Meta’s Glasses
The person across the table may be recording you, and nothing on the frame says so. That is the objection German data protection authorities and privacy groups are pressing as…
DeepX’s $2.2 Billion Round
A Seoul-based chip designer that most outsiders had never heard of is now worth $2.2 billion. DeepX closed a new funding round at roughly four times its previous valuation, according…
Cloud Capital Spending’s $1.2 Trillion Forecast
Every time Morgan Stanley’s cloud team updates its spreadsheets, the number gets bigger. The bank now expects global cloud capital spending to reach $1.2 trillion in 2027, up 30% from…
Taiwan Memory’s Two-Day Run
On Taiwan’s stock exchange, the price boards told a different story from Seoul’s. Memory stocks rose limit-up for a second straight session on August 3, with Nanya Technology and Winbond…
Claude Comes to India’s Banks
A bank in Mumbai will soon run Claude over customer records that never cross the border. Anthropic will offer local data processing for its models in India through Amazon Bedrock,…
Intel’s Cheaper Path Around TSMC’s Packaging
Intel plans to mass-produce a new advanced packaging technology called EMIB-T in 2027, and it says the approach will cost about 50% less than TSMC’s CoWoS, according to TechPowerUp. If…
