South Korea Fines Google and Apple $45 Million Over In-App Payments
South Korea’s communications regulator approved fines totaling 63.7 billion won, about $45 million, against Google and Apple on Tuesday, finding that the two companies abused their dominance of mobile app…
Malaysia Seizes $12 Million of AI Chips Hidden in Server Chassis at Kuala Lumpur Airport
The shipment looked like ordinary hardware. Thirty server chassis arrived at Kuala Lumpur International Airport this month, and when officers opened them they found advanced AI chips inside, according to…
Robot Software Startup Physical Intelligence Seeks $1 Billion at $20 Billion Value
The company selling the software has no product on the market and no revenue to report. Physical Intelligence, which writes general-purpose software for robots, is nonetheless in talks to raise…
Barclays Buys Default Protection on $100 Billion of AI Data Center Loans
The lender that helped arrange the debt now wants to be insured against it. Barclays has been buying protection against defaults on more than $100 billion of loans tied to…
Constellation Wins $5 Billion Federal Loan Backing for Nuclear Uprates
Chris Wright picked the site as carefully as the number. Standing at an Illinois nuclear plant that sells its output to Google, the energy secretary said Tuesday that the federal…
Micron Raises Its Bet on Boise, Starting With Housing
The corner of Capitol Boulevard and Island Avenue in Boise is a few blocks from Micron Technology’s headquarters and, for the past several years, a symbol of what happens when…
Jio’s Mumbai Debut Values Reliance’s Telecom Arm at $131 Billion
More than 13.8 million people applied for shares in Jio Platforms. On Oct. 28 the company gave them a listing, and the scale of that queue turned out to be…
Amazon’s $11.5 Billion Satellite Deal Clears the FCC
The emergency message an iPhone can send from a trailhead with no bars travels through a satellite owned by Globalstar. This week the company that operates that satellite moved a…
TSMC Weighs a 20% Packaging Increase as AI Chips Outgrow Their Packages
The number that best describes the packaging bottleneck is a multiple of the reticle, the largest field a lithography tool can expose in a single pass. TSMC’s CoWoS-L interposer is…
Broadcom Discloses a $43 Billion Backstop Tied to AI Rack Leases
The special-purpose vehicle in Broadcom’s Oct. 26 financing arrangement carries an unusually candid name. It is called Backstop, and its job is to absorb the residual value of custom AI…
